MAGNUM iCP™
Introduced in October 2006, the Magnum iCP offers manufacturers of CMOS Image Sensors (CIS) the high level of efficiency and capacity required for both engineering and high-volume production test.

Magnum iCP (image Capture Processor) boasts an optimized image-capture and analysis architecture, integrated with a high-quality light source (illuminator) and a contemporary probing system. This combination provides users with a complete package for probing up to forty (40), 256 mega pixel CIS devices. This is the highest number of CIS devices being tested in parallel today.

The Magnum iCP was developed in collaboration with key customers in response to the need for a cost-efficient, high-volume, test solution for CIS devices. By utilizing the proven performance of the Magnum product line, a production-worthy test solution was developed quickly, reliably, and at a very impressive price point.

The market for consumer products that utilize CMOS image sensor devices is explosive and are being featured in numerous products such as cell phones, still cameras, web cams, and PDA's. CIS technology leverages the power, integration, and cost benefits associated with CMOS technology, making it the ideal solution for the high-volume consumer market. Nextest's Magnum iCP is the answer for high-volume, low-cost CIS production.

The Magnum iCP can capture pixel data at 100MHz with up to 14 bits of precision. The Image Capture Ram (ICR) can hold up to 64 image planes, each with a size of 32K x 32K. Images can be captured in Horizontal Sync, Vertical Sync, Accumulate Sum or Accumulate Average mode. Each of the 40 devices under test has its own image processor, thus providing users with an efficient, high throughput, large capacity test solution.

MAGNUM iCP-EV™
The Magnum iCP-EV is a scaled-down version of the Magnum iCP and offers CIS manufacturers a low-cost engineering alternative for program development and debug. Due to the system's small physical size, engineering can perform the necessary work in an office environment, prior to moving devices to the larger Magnum iCP's for volume-production testing. This innovative approach allows for a smooth transition from engineering to production test of CIS devices-a much more cost-effective method than utilizing expensive, "largeiron" test equipment for engineering.